Future exascale supercomputers will be built using these HPE Lego-like cabinets able to hold nearly 100,000 AMD EPYC Cores

HPE's Cray EX4000 supports modular designs, scaling to 98,304 coresSlingshot 400 interconnect doubles throughput, vital for exascale systemsAMD and Nvidia collaborations help compute density exceed 10 petaflops Future exascale supercomputers…

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AMD Ryzen 7 9800X3D CPU To See Wider Availability Next Quarter, Team Red Rushes To Fix Supply Issues

AMD's "highly-demanded" Ryzen 7 9800X3D CPU will be broadly available in the next quarter as the SKU witnesses an "unexpected" supply shortage in the markets. AMD Has Seen Rather "Unexpected"…

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Weak demand prevents Amazon from deploying AMD's Instinct AI accelerators in the cloud — the company plans to strengthen its portfolio with Nvidia Blackwell GPUs

Amazon Web Services does not see enough demand for AMD's Instinct MI300-series accelerators for AI and HPC to deploy them in the cloud. Source

Continue Reading Weak demand prevents Amazon from deploying AMD's Instinct AI accelerators in the cloud — the company plans to strengthen its portfolio with Nvidia Blackwell GPUs

Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 HBM modules. Source

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