US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project

SK Hynix gets $458 million from the U.S. government via the CHIPS Act to build an HBM packaging plant in Indiana. Source

Continue Reading US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project

DJI narrowly escapes U.S. drone ban, for now — company has one year to demonstrate its products don’t pose a national security risk

The U.S. is passing a law that requires DJI to have it devices certified that it's not a risk to the U.S., or else it would face an automatic ban.…

Continue Reading DJI narrowly escapes U.S. drone ban, for now — company has one year to demonstrate its products don’t pose a national security risk