Apple Likely Delaying The Use Of TSMC’s 2nm Technology For iPhones Due To Low Monthly Production; By 2026, Wafer Capacity Could Increase By Eight Times

The launch of the iPhone 17 family next year with Apple’s A19 and A19 Pro on the industry’s first 2nm process would give the company a generational advantage like no…

Continue Reading Apple Likely Delaying The Use Of TSMC’s 2nm Technology For iPhones Due To Low Monthly Production; By 2026, Wafer Capacity Could Increase By Eight Times

Samsung's archrival becomes first chipmaker to launch 300+ layer TLC NAND flash memory; SK Hynix's 321-layer 1-terabit TLC paves the way for more affordable 100TB+ SSDs

SK Hynix's 321-layer NAND targets AI-driven data storage needs321-layer NAND flash improves data transfer speed by 12%AI storage demands drive innovation in high-capacity NAND solutions Samsung and SK Hynix have…

Continue Reading Samsung's archrival becomes first chipmaker to launch 300+ layer TLC NAND flash memory; SK Hynix's 321-layer 1-terabit TLC paves the way for more affordable 100TB+ SSDs

Apple’s Bold Dream Of A ‘Single Slab Of Glass’ iPhone Was Pinned On The iPhone 18, But Technical Hurdles May Shatter That Vision

An all-screen iPhone with zero bezels was reported to launch in 2026, but it appears that several technical setbacks could shatter the company's dream. With the time frame at hand,…

Continue Reading Apple’s Bold Dream Of A ‘Single Slab Of Glass’ iPhone Was Pinned On The iPhone 18, But Technical Hurdles May Shatter That Vision