AMD’s Newest Patent Filing Reveals Unique “Chip Stacking” Method, Significantly Scaling Up Die Usage

AMD's newest patent filing has revealed that the firm is looking towards adopting "multi-chip stacking" in its future Ryzen SoCs, leading towards die scalability. AMD Might Implement "Overlapped" Chip Stacking,…

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GlobalFoundries gets $1.5 billion subsidy from U.S. gov't after it was fined for violating export laws to China

GlobalFoundries signed a deal to get $1.5 billion under the CHIPS and Science Act even after being fined for violating U.S. export laws by supplying advanced chips to Chinese entities.…

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