Top Samsung rival unveils “world’s largest capacity” 16-Layer HBM3e chips — SK hynix promises boosted performance for all

The 16-Layer HBM3e chips are expected to roll-out in 2025New chips offer improved AI learning and inference capabilitiesUsers can expect lower latency, Sk hynix claims SK hynix has announced plans…

Continue Reading Top Samsung rival unveils “world’s largest capacity” 16-Layer HBM3e chips — SK hynix promises boosted performance for all